Wafer Fabrication

  • Wafer Fabrication Lab (Fab) overview with employees: 2000 sq ft, class 100, controlled and monitored environment

    View from the south end of the wafer fabrication lab.

    Scrub, coat and develop wafer tracks with mini-environments for automatically processing wafers.Scrub, coat and develop wafer tracks with mini-environments for automatically processing wafers.

    Lab monitoring system for temperature, humidity, pressure, and particles.

  • Typical photomask, anti-reflection chrome on quartz, line widths to .35 microns.

    Typical substrates, Quartz (SiO2), Lithium Niobate (LiNbO3), and Lithium Tantalate (LiTaO3). Sizes to 4″ round and 10″ rectangular.

  • Wafer Scrub Track to automatically clean and HMDS vapor prime 3 & 4″ wafers.

    Close-up of Wafer Scrub Track to automatically clean and HMDS vapor prime 3 & 4″ wafers.

    Manually clean large rectangular substrate in preparation for photoresist application.

  • Wafer Coat & Bake Track to automatically spin coat photoresist and pre-exposure bake 3 & 4″ wafers.

    Close-up of Wafer Coat & Bake Track to automatically spin coat photoresist and pre-exposure bake 3 & 4″ wafers.

    Manually spin coat large rectangular substrate.

  • Manually mask align in preparation for contact expose, 3 & 4″ wafers and rectangular substrates to 10″ long.

    Contact expose photoresist by xenon flash, 3 & 4″ wafers.

    Contact expose photoresist by xenon flash, large rectangular substrates to 10″ long.

  • Wafer develop track to automatically develop photoresist pattern and bake 3 & 4″ wafers.

    Close-up of wafer develop track to automatically develop photoresist pattern and bake 3 & 4″ wafers.

    Manually develop large rectangular substrate to form photoresist pattern.

  • Vacuum metallize with a chrome flash and .1 to 1 micron aluminum film over the patterned photoresist.

    Loading 3 & 4″ wafers for metallization.

    Loading large rectangular substrates for metallization

  • Lifting off the photoresist and unwanted aluminum in a solvent bath.

    Die visual inspection 100%.

    Lifting off the photoresist and unwanted aluminum in a solvent bath for a large rectangular substrate.

  • RF wafer probing each visually good die, 100%, 2 automatic probers with VNAs.

    Close-up RF wafer probing each visually good die, 100%, 2 automatic probers with VNAs.

    Atomic Force Microscope for nanometer scale inspection.

  • RIE Plasma frequency trim of narrow-band quartz wafers, die, and components.

    Close-up of RIE Plasma frequency trim of narrow-band quartz wafers, die, and components.

    Thin film AI phase correct dispersive filter components using a laser cut shadow mask.