Component assembly lab overview with employees, 5000 sq feet, class 100, controlled and monitored environment.
Component assembly lab, partial view from the south.
Sandblast wafer backside thru a fine screen to protect bulk spurious.
Dice wafer using an automatic diamond bladed saw.
Close-up of wafer dice using an automatic diamond bladed saw.
Typical component packages of nickel or gold plated kovar or ceramic.
SAW filters in kovar Dual Inline Packages (DIP) with internal impedance matching elements.
Low Frequency Resonator SAW Filter in surface mount package with toroid inductors.
Manual die attach and damp in component package using a low-stress silicone adhesive.
Close-up of manual die attach and damp in component package using a low-stress silicone adhesive.
Manual application of silicone damping.
Wire bonding using aluminum wedge bond or gold ball bond.
Close-up of wire bonding using aluminum wedge bond or gold ball bond.
Small SAW component wire-bonded.
Component pre-seal room temperature s-parameter electrical test.
Component pre-seal internal visual inspection per MIL-STD-883 method 2017, 100%
Pre-seal 12 hour 125 C stabilization vacuum bake.
Hermetic package seal in dry N2 by resistance seam weld, after 12 hour 125 C vacuum bake.
Close-up of hermetic package seal by resistance seam weld.
Package fine leak test per MIL-STD-883 method 1014 condition A2, and gross leak test per MIL-STD-202 method 112 condition D.
Package fine leak test per MIL-STD-883 method 1014 condition A2.
Helium bomb before leak test.
Package mark with YAG laser.
Example of lid marked with YAG laser.
Test station for component test, automatic s-parameters over temperature, 100%.
Final external visual inspection per MIL-STD-883 method 2009, 100%.
Electrical Test Fixture for Leadless Chip Carrier packaged SAW Component with external impedence matching. Shown with cover removed.